ANSYS Q3D Extractor

ANSYS Q3D Extractor software is the premier 3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment. Q3D Extractor uses method of moments (integral equations) and FEMs to compute capacitive, conductance, inductance and resistance matrices. It uses the fast multipole method (FMM) to accelerate the solution of the integral equations. Outputs from the solver include current and voltage distributions, CG and RL matrices.

Q3D Extractor efficiently performs 3-D and 2-D electromagnetic field simulation required for the extraction of resistance, conductance, partial inductance and capacitance RLCG parameters from a design and automatically generates a netlist in many formats, including SML (ANSYS Simplorer format) and SPICE. Q3D Extractor is capable of generating S-parameters exported using the Touchstone format, which represent the n-port network parameter data of a device or passive interconnect network. Such frequency dependency can be included in simulations through dynamic links with ANSYS Designer and ANSYS Simplorer products.

components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in HFSS’ electrical layout environment while, at the same time, simulating for all 3-D features, such as trace thickness and etching as well as bondwires, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated ANSYS Optimetrics tool in the HFSS for ECAD interface. Beyond the convenient electrical layout environment, HFSS includes a fast 2.5-D planar electromagnetic solver based on the method of moments. This provides the flexibility to use a fast solver optimized for planar structures in the initial design phase, and then turn to the reliable 3-D accuracy of HFSS finite elements for optimization and design verification. Signal integrity engineers use HFSS for ECAD to integrate within established EDA design flows to evaluate signal and power quality, including transmission path losses, reflection loss from impedance mismatches, parasitic coupling, ground bounce and radiation.